10.06.24 | Praktikum, Studentenjobs, Vollzeit | Chemnitz | www.zfm.tu-chemnitz.deBonding plays a crucial role in microelectromechanical systems (MEMS) technology by providing excellent hermetic sealing, high process yield, and good reliability. It enables the encapsulation and sealing of MEMS components at the wafer or chip level, ensuring protection and enhancing device performance
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